atcomsystems.ca/forum
I know this topic has been discussed ad nauseum in other forums, but I can't seem to nail down a specific topic that covers what I need (Search is not my friend today).

I'm looking for documentation showing specific requirements regarding sinking your own ground rod for grounding racks and other telecom/data equipment. My recollection is that the separate rod needs to be bonded to the electrical panel or ufer to prevent potential between the ground rod and the ground that's on the energized equipment mounted in the rack.

Can someone please straighten me out, with reference to code (electric, BICSI, etc.)?

Thanks!

Justin
This topic was posted a long time ago, but I believe it's still relevant.

Common bond was in the Bell System Practices, I'm not sure what all BICSI copied over, I know they did a lot of it, but all that could have changed. I'm not at all familiar with BICSI Standards. I would think common bond is still a followed practice. To me it's just common sense to have no difference in potential in the grounds.

EDIT: To add, I don't recall common bond ever being in the NEC.
Grounding & Bonding is covered extensively in EIA/TIA 607 spec. Unfortunately my copy of the spec is OLD (20th Century).

Google EIA 607 you should find plenty of good info.

Sam
So did BICSI adopt the ANSI Standard in it's entirety? I did know they adopted parts.

Good info Sam.
I was always tought the same as Bill, all grounds should be bonded to building or common ground.
Thanks! The link https://www.psihq.com/iread/strpgrnd.htm provides pretty clear reference. If you're following NEC guidelines only, it would be enough to tell you my understanding is correct. I was challenged by a "fact" that BICSI did not speak to the need for bonding supplemental grounds to the building grounding system, and that BICSI was over and above anything the NEC said. If BICSI doesn't speak to it, it should for this very reason.

Justin
So that tells me BICSI didn't adopt all the ANSI standards.

Justin -

The NEC covers Grounding and Bonding from a SAFETY standard.

BICSI, EIA/TIA/ANSI cover Grounding and Bonding from a PERFORMANCE standard.

B I G difference.

Grounding in the era of Steppers, XBar, 1A2 and the like was a lot easier then now. 2 or 3 volt imbalance won't effect a 1970 era phone system. But a "modern" VOIP system? It would hose it.

I worked for a company that was contracted by NBC to provide Telephone service to the Olympics in Russia (1984?). We opted to provide a XBar, because the question was raised whether a "new" electronic system (NEAX 22L) would function with the poor quality Russian infrastructure. Grounding was a major concern. Of course, because of Afghanistan we never got to do the job.


Sam
Although the wording isn't very clear in EIA 607, it does say the same thing.

Justin


Here is a video from Mike Holt, this is talking about CNC machines but same would apply to any of our non-electromagnetically/digital equipment.

See the diagram at 15:00 for the quick explanation.
© Sundance Business VOIP Telephone Help